Ceramic circuit board and method for manufacturing the same

Details Ceramic circuit board and method for manufacturing the same Ceramic circuit board and method for manufacturing the same

2006-12-05

2006-12-05

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S123100, C174S258000, C174S264000, C361S761000

Reexamination Certificate

active

07143929

ABSTRACT:
In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 μm longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.

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