Ceramic circuit board and manufacturing method thereof

Details Ceramic circuit board and manufacturing method thereof Ceramic circuit board and manufacturing method thereof

1996-10-21

1997-12-30

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428901, 174256, B32B 300, H05K 103

Patent

active

057028079

ABSTRACT:
A conductor circuit 12 made of aluminum is provided on a green sheet 10, the primary material of which is ceramic powder. The green sheets 10 are laminated and integrated into one body so that the conductor circuit 12 is not exposed onto the surface but is covered with the green sheet 10. The laminated body is fired at the firing temperature not lower than 660.degree. C. and a portion of the inner conductor circuit of the thus obtained sintered body is then exposed onto a surface of the substrate.

REFERENCES:
patent: 4490429 (1984-12-01), Tosaki
patent: 4608316 (1986-08-01), Toda
patent: 5139852 (1992-08-01), Baise
patent: 5229213 (1993-07-01), Horiuchi et al.
Patent Abstracts of Japan; A 5235549; vol. 17, No. 691 (Dec. 1993).
Patent Abstracts of Japan; A 3276797; vol. 16, No. 96 (Mar. 1992).
"Base Metal Thick Film Condutors", S.J. Stein, et al.; pp. 73-79.
U.S. application No. 08/115,767, Horiuchi et al., filed Sep. 3, 1993, Assignee Shinko Electric Industries Co., Ltd.
U.S. application No. 08/265,028, Horiuchi et al., filed Jun. 24, 1994, Assignee Shinko Electric Industries Co., Ltd.

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