Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-08-14
1984-05-01
Hearn, Brain E.
Metal working
Method of mechanical manufacture
Assembling or joining
29588, 29577C, 29827, 357 70, 174 52FP, H01L 2350, H01L 2348, H05K 502
Patent
active
044452713
ABSTRACT:
A ceramic chip carrier having a lead frame thereon with a removable lead frame support which does not bond to the ceramic during the bonding procedure and is later removed. A perforated ground pad is bonded to the substrate simultaneously with the leads of the lead frame and is attached to the lead frame support. The support area is of reduced thickness relative to the rest of the lead frame so that it does not come in contact with the ceramic substrate during the bonding procedure. After firing and bonding of the lead frame to the substrate, the unbonded support rim is removed by pinch cutting, etching or the like.
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AMP Incorporated
Hearn Brain E.
Hey David A.
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