Ceramic chip carrier with lead frame having removable rim

Details Ceramic chip carrier with lead frame having removable rim Ceramic chip carrier with lead frame having removable rim

1981-03-27

1983-10-04

Godici, Nicholas P.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 174 52FP, H01L 2348

Patent

active

044082185

ABSTRACT:
A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without altering the relative positions of the tip portions. The rim is thus raised above the center region of the substrate and does not bond to the substrate and is thus readily removed after bonding the lead frame to the substrate.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3711625 (1973-01-01), Dupuis
patent: 3882597 (1975-05-01), Chayka et al.
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4049903 (1977-09-01), Kobler
patent: 4089733 (1978-05-01), Zimmerman
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4137546 (1979-01-01), Frusco
patent: 4141712 (1979-02-01), Rogers
patent: 4204317 (1980-05-01), Winn
patent: 4289922 (1981-09-01), Devlin
patent: 4362902 (1982-12-01), Grabbe
patent: 4380042 (1983-04-01), Angelucci et al.

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