Ceramic carrier transport for die attach equipment

Details Ceramic carrier transport for die attach equipment Ceramic carrier transport for die attach equipment

1994-06-03

1996-08-20

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156358, 156362, 156538, 29740, 29742, 29759, B23B 3500, B23P 1900

Patent

active

055475370

ABSTRACT:
An aligning and positioning system for a bonder including a bond sensor for sensing the X, Y and .theta. coordinates of a substrate at the bonding location and a die sensor for sensing the X, Y and .theta. coordinates of the die on a die transport. A controller correlates the sensed coordinates from the sensors and adjusts the X, Y and .theta. of the die and the substrate relative to each other to place the die at a preselected bond site on the substrate. The Z coordinate of the surface of the substrate, as well as its planarity, may be sensed by a Z optical sensor. The X and Y coordinates of the substrate are adjusted and the .theta. coordinate of the die on the die transport is adjusted.
A pattern recognition system is used with the die and bond sensors to determine the coordinates as well as quality control of the substrate prior to bonding, the quality of paste pattern on the die or the substrate prior to bonding and the quality of the bond and the coordinates of the die after bonding. In a calibration phase, the controller correlates the X, Y and .theta. coordinates of the substrate transport and the bond sensor, and the X, Y and .theta. coordinates of the die transport with the die sensor. The magnification factor of the two sensors are also correlated.

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Brochure for Swissline 9000 from Alphasem.

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