Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1987-07-06
1988-09-13
Tolin, G. P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
357 81, 361385, 361398, 361407, 361414, 439 67, 439329, H05K 720
Patent
active
047713666
ABSTRACT:
A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior ceramic cards. The ceramic card assembly combines ceramic cards with flexible power distribution structures which provide low inductance and low resistance power distribution, making ceramic cards available for high performance VLSI systems. Each ceramic card assembly comprises a ceramic card having a plurality of chip sites and power contacts thereon, and at least one flexible power distribution structure having alternating insulation (i.e. polyimide) layers and conductor (i.e., copper) layers, the flexible power distribution structures are mounted adjacent to the ceramic cards so that conductive layers of the ceramic cards are selectively exposed to the power contacts. The ceramic card assemblies are preferably combined into a field replaceable unit that includes cold plates between ceramic cards. High density packages further include ceramic in-line packages which quadruple current day memory density.
REFERENCES:
patent: 3007131 (1961-10-01), Dahlgrer
patent: 3312878 (1967-04-01), Poch et al.
patent: 3579206 (1971-05-01), Grange
patent: 3806767 (1974-04-01), Lehrfeld
patent: 3993123 (1976-11-01), Chu et al.
patent: 4120021 (1978-10-01), Roush
patent: 4186422 (1980-01-01), Laemer
patent: 4439815 (1984-03-01), Close
patent: 4619316 (1986-10-01), Nakayama
patent: 4628411 (1986-12-01), Balderes
patent: 4646202 (1987-02-01), Hook
patent: 4688151 (1987-08-01), Kraus
patent: 4704658 (1987-11-01), Yokouchi
Dorler et al., "A Ceramic Card Concept", Apr. 1982, pp. 456-459, published by the IEEE.
Fedoush et al., "Low-Profile Ceramic-Card Cooling Package", IBM TDB, Oct. 1985, vol. 28, No. 5, pp. 2114-2115.
Aichelmann et al., "Three-Dimensional MLC Substrate Integrated Circuit Support Package", IBM TDB, Apr. 1978, vol. 20, No. 11A, pp. 4349-4350.
Arnold et al., "Cap with Metallization Designed for Reflow Solder Attachment to a Substrate Seal Band", IBM TDB, Nov. 1979, vol. 22, No. 6, p. 2278.
Haddad et al., "Dual Seal Band Metallurgy on MLC Substrates", IBM TDB, Feb. 1980, vol. 22, No. 9, pp. 4059-4061.
Blake Bruce E.
Hultmark Eric B.
Presti Frank P.
Ricci Raymond
Rippens Roger A.
International Business Machines - Corporation
Meyers Steven J.
Tolin G. P.
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