Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1993-09-20
1995-02-28
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228121, B23K 119, B23K 3102
Patent
active
053929829
ABSTRACT:
A method of coating and bonding a substrate with particles of a ceramic selected from the group consisting of diamond, carbon, graphite, and graphite or carbon-carbon composite, comprising: providing the substrate and at least one of the ceramic particles; selecting at least a carbide-forming substance consisting principally of an element which is other than Ni, Cr, and Co and is capable of forming a carbide to provide a coating material; applying said coating material onto at least one component of the substrate and the at least one ceramic particle; placing the at least one ceramic particle on the substrate; and heating the product of step (D) at a temperature sufficient to form a liquid-diffusion formed, carbide coating on the at least one ceramic particle. The ceramic particles are then coated with strong, adherent, substantially defect-free, and thermomechanically shock resistant metallized layers which are capable of practical uses over 630.degree. C.
REFERENCES:
patent: 3574579 (1971-04-01), Clarke
patent: 3650714 (1972-03-01), Farkas
patent: 3915369 (1975-10-01), Schmidt-Brueken et al.
patent: 3949263 (1976-04-01), Harper
patent: 4009027 (1977-02-01), Naidich et al.
patent: 4239502 (1980-12-01), Slack et al.
patent: 4396677 (1983-08-01), Intrater et al.
patent: 4750914 (1988-06-01), Chikaoka et al.
patent: 4776862 (1988-10-01), Wiand
patent: 4899922 (1990-02-01), Slutz et al.
patent: 4968326 (1990-11-01), Wiand
patent: 5143523 (1992-09-01), Matarrese
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