Ceramic bonded grinding tools with graphite in the bond

Details Ceramic bonded grinding tools with graphite in the bond Ceramic bonded grinding tools with graphite in the bond

1978-02-21

1979-06-12

Arnold, Donald J.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51308, B24D 314, B24D 706

Patent

active

041578970

ABSTRACT:
Ceramic bonded grinding and honing tools employing diamond or cubic boron nitride abrasive particles are improved by the inclusion of from 10 to 53%, by volume, of graphite in the bond, based on the total bond solids, including graphite. The bond must have a porosity volume less than 15% for honing applications and less than 10% for grinding wheels, preferably the graphite should be finely particulate. Applications in dry grinding and honing of hard materials are described. For dry grinding the optimum graphite content of the bond is from 34 to 45 volume percent. The bond may include crystalline filler such as alumina, zirconia, silicon carbide, or crystalline filler formed in situ by devitrification; and the abrasive particles may be metal coated. MoS.sub.2 or hexagonal boron nitride may substitute for all or part of the graphite and metal powders may be employed to replace up to 50% by volume of the graphite or graphite substitute materials.

REFERENCES:
patent: 3081161 (1963-03-01), Cantrell
patent: 3383191 (1968-05-01), Thomas
patent: 3454384 (1969-07-01), Kumagai
patent: 3650714 (1972-03-01), Farkas
patent: 3664819 (1972-05-01), Sioui et al.
patent: 3819387 (1974-06-01), Leger et al.

Affiliated with

Also associated with

Rating

Ceramic bonded grinding tools with graphite in the bond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic bonded grinding tools with graphite in the bond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic bonded grinding tools with graphite in the bond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1108233