Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-03-03
1998-07-07
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257705, 257706, 257783, 257778, 257779, H01L 2306, H01L 2310, H01L 2334, H01L 2348
Patent
active
057773858
ABSTRACT:
An improved package structure for integrated-circuit chips is disclosed. In accordance with a preferred embodiment of the present invention, the integrated-circuit packaged structure comprises a wiring substrate, an integrated-circuit chip, and a heat spreader. The integrated-circuit chip has a first surface and a second surface, wherein the first surface is electrically and mechanically connected to the wiring substrate via a first set of solder joints. The heat spreader is connected to the second surface of the integrated-circuit chip via a second set of solder joints. The heat spreader includes an adhesion-promotion layer on top of a silicon layer, such that heat generated from the integrated-circuit chip can be efficiently transmitted to and subsequently dissipated by the heat spreader.
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Clark Jhihan B.
Dillon Andrew J.
England Anthony V.S.
International Business Machines - Corporation
Ng Antony P.
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