Ceramic aluminum laminate and thermally conductive adhesive ther

Details Ceramic aluminum laminate and thermally conductive adhesive ther Ceramic aluminum laminate and thermally conductive adhesive ther

1994-03-14

1996-02-13

Davis, Jenna L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, B32B 2738, B32B 3120

Patent

active

054908957

ABSTRACT:
A 51/2" by 53/4" flat ceramic board is bonded to an aluminum frame which serves as a heat sink. The bonding agent intermediate the board and the frame is thermally conductive and comprises an epoxy containing Master Bond EP21TDCAOHT. The formed laminate or bond is capable of withstanding repeated stresses occurring through thermal cycling in temperatures from -60 degrees centigrade to +125 degrees centigrade and vibration and humidity testing.

REFERENCES:
patent: 3305416 (1967-02-01), Kahon
patent: 4299873 (1981-11-01), Ogihara
patent: 4524238 (1985-06-01), Butt
patent: 4866108 (1989-09-01), Vachun
Material Safety Data Sheet; U.S. Dept. of Labor; EP21AOHT-1; undated.
"MasterBond Polymer Adhesive EP21AOHT"; Technical Data Sheet; undated.
"Novolac"; Hawley's Condensed Chemical Dictionary; 11th Edition; Sax and Lewis, ed.; Van Nostrand and Reinhold; NY; undated; p. 840.
"Phenolic Resin Adhesives"; Handbook of Adhesives; Skeist, ed.; Nostrand Reinhold; NY; 1990; pp. 316-340.
"Epoxy Resin Adhesives"; Handbook of Adhesives; Skeist, ed.; Nostrand Reinhold; NY; 1990; pp. 347-358.
"Eccobond 45" Technical Bulletin; Emerson & Cuming; 1985.
"Master Bond Polymer Adhesive EP21TDCAOHT" Technical Data Sheet; undated.

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