Coating processes – Centrifugal force utilized
Reexamination Certificate
2005-02-04
2008-11-18
Jolley, Kirsten C (Department: 1792)
Coating processes
Centrifugal force utilized
C427S272000, C427S277000, C427S282000, C427S294000, C427S346000, C427S356000, C427S368000, C427S458000, C427S466000, C427S468000, C118S050000, C118S052000, C118S057000, C118S107000, C118S320000, C118S621000
Reexamination Certificate
active
07452568
ABSTRACT:
The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
REFERENCES:
patent: 3997105 (1976-12-01), Hayden et al.
patent: 4271209 (1981-06-01), DePalma et al.
patent: 4286443 (1981-09-01), Hunter
patent: 4400166 (1983-08-01), Chulay et al.
patent: 4585434 (1986-04-01), Cole et al.
patent: 5062896 (1991-11-01), Huang et al.
patent: 5376403 (1994-12-01), Capote et al.
patent: 5538789 (1996-07-01), Capote et al.
patent: 5591114 (1997-01-01), Romanauskas
patent: 5652042 (1997-07-01), Kawakita et al.
patent: 5716663 (1998-02-01), Capote et al.
patent: 5744285 (1998-04-01), Felton et al.
patent: 5830389 (1998-11-01), Capote et al.
patent: 5865891 (1999-02-01), Linliu
patent: 5912046 (1999-06-01), Eldridge et al.
patent: 5948533 (1999-09-01), Gallagher et al.
patent: 5977490 (1999-11-01), Kawakita et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6059952 (2000-05-01), Kang et al.
patent: 6723238 (2004-04-01), Romanauskas
patent: 6783675 (2004-08-01), Rovira
Buchwalter Leena Paivikki
Buchwalter Stephen L.
Casey Jon
Feger Claudius
Flotta Matteo
Connolly Bove & Lodge & Hutz LLP
International Business Machines - Corporation
Jolley Kirsten C
Morris, Esq. Daniel P.
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