Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-12
2005-04-12
Thompson, Gregory D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S185000, C361S694000, C361S695000, C361S719000, C361S721000, C454S184000
Reexamination Certificate
active
06879486
ABSTRACT:
An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g, lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exists. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
REFERENCES:
patent: 4223368 (1980-09-01), Dattilo
patent: 4277815 (1981-07-01), Skroupa
patent: 4375290 (1983-03-01), Zucchi et al.
patent: 4410760 (1983-10-01), Cole
patent: 4442475 (1984-04-01), Franklin et al.
patent: 4672509 (1987-06-01), Speraw
patent: 4694555 (1987-09-01), Russell et al.
patent: 4745456 (1988-05-01), Clemens
patent: 4751872 (1988-06-01), Lawson, Jr.
patent: 4768286 (1988-09-01), Ketcham
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4795354 (1989-01-01), Owen
patent: 4855870 (1989-08-01), Russell et al.
patent: 4894749 (1990-01-01), Elko et al.
patent: 4924352 (1990-05-01), Septfons
patent: 4998180 (1991-03-01), McAuliffe et al.
patent: 5005638 (1991-04-01), Goth et al.
patent: 5027254 (1991-06-01), Corfits et al.
patent: 5109981 (1992-05-01), Maston, III et al.
patent: 5170323 (1992-12-01), Perretta et al.
patent: 5210680 (1993-05-01), Scheibler
patent: 5214570 (1993-05-01), Shah et al.
patent: 5263537 (1993-11-01), Plucinski et al.
patent: 5280411 (1994-01-01), Dirks et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5353193 (1994-10-01), Chia et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5438226 (1995-08-01), Kuchta
patent: 5493473 (1996-02-01), Yanagi
patent: 5617296 (1997-04-01), Melville et al.
patent: 5632021 (1997-05-01), Jennings et al.
patent: 5667870 (1997-09-01), McCullough
patent: 5680295 (1997-10-01), Le et al.
patent: 5895884 (1999-04-01), Davidson
patent: 5912799 (1999-06-01), Grouell et al.
patent: 5923532 (1999-07-01), Nedved
patent: 5930487 (1999-07-01), Story et al.
patent: 5940266 (1999-08-01), Hamilton et al.
patent: 5940288 (1999-08-01), Kociecki
patent: 5990418 (1999-11-01), Bivona et al.
patent: 6053748 (2000-04-01), Bricaud et al.
patent: 6100468 (2000-08-01), Niggl et al.
patent: 6128187 (2000-10-01), Mimlitch, III et al.
patent: 6134107 (2000-10-01), Kerrigan et al.
patent: 6141213 (2000-10-01), Antonuccio et al.
patent: 6198629 (2001-03-01), Cannon et al.
patent: 6230541 (2001-05-01), Mimlitch, III et al.
patent: 6239984 (2001-05-01), Koradia et al.
patent: 6261104 (2001-07-01), Leman
patent: 6268567 (2001-07-01), Brodsky et al.
patent: 6272012 (2001-08-01), Medin et al.
patent: 6274821 (2001-08-01), Echigo et al.
patent: 6280317 (2001-08-01), Przilas et al.
patent: 6288898 (2001-09-01), Johnson et al.
patent: 6292361 (2001-09-01), Johnson et al.
patent: 6292373 (2001-09-01), Li et al.
patent: 6293331 (2001-09-01), Wang
patent: 6297958 (2001-10-01), Lutz, Jr.
patent: 6430052 (2002-08-01), Kordes et al.
patent: 6433283 (2002-08-01), Brodsky et al.
patent: 6452796 (2002-09-01), Roy
patent: 6463997 (2002-10-01), Nicolai et al.
patent: 6504722 (2003-01-01), Vittet et al.
patent: 6544311 (2003-04-01), Walton et al.
Banton Randall G.
Bardo Jason E.
Blanchet Don W.
Freeburn, Jr. John R.
Gust Mike W.
Mercury Computer Systems, Inc.
Nutter & McClennen & Fish LLP
Powsner David J.
Thompson Gregory D.
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