Centering device for automatic placement of chip components in h

Details Centering device for automatic placement of chip components in h Centering device for automatic placement of chip components in h

1977-12-08

1979-01-23

Husar, Francis S.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

29740, 214 85D, 228 6A, 294 64R, H01L 2158, H01L 2196

Patent

active

041356306

ABSTRACT:
A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.

REFERENCES:
patent: 3651957 (1972-03-01), Ball
patent: 4045073 (1977-08-01), Mosterd

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