Center gate semiconductor device having pipe cooling means

Details Center gate semiconductor device having pipe cooling means Center gate semiconductor device having pipe cooling means

1979-12-26

1983-05-31

James, Andrew J.

357 17, 357 74, 357 81, 357 82, H01L 2348, H01L 2944, H01L 2952

Patent

active

043863620

ABSTRACT:
A transcalent semiconductor device comprises a body of semiconductor material having first and second major opposed surfaces. The first surface includes at least one region of first type conductivity and a region of opposite type conductivity. A first heat pipe having a conductive contact disc is in electrical and thermal contact with substantially all of the first surface. The conductive contact disc has an aperture therein. A control electrode for initiating conduction through the semiconductor material extends through the aperture in the disc and contacts the region of opposite type conductivity. A second heat pipe is disposed in electrical and thermal conductive relationship with the second surface. In an alternative embodiment, a fiber optic light pipe controls the initiation of conduction through the semiconductor material by transmitting photons to the region of opposite type conductivity.

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