Cellulose-containing polishing compositions and methods...

Details Cellulose-containing polishing compositions and methods... Cellulose-containing polishing compositions and methods...

2006-08-08

2006-08-08

Ackun Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C438S693000, C051S307000

Reexamination Certificate

active

07086935

ABSTRACT:
An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus compound, 0.005 to 10 weight percent of a water miscible organic solvent, and water.

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