Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-04-19
2011-04-19
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679010, C361S679310, C361S729000, C361S736000, C439S065000
Reexamination Certificate
active
07929310
ABSTRACT:
According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
REFERENCES:
patent: 4892376 (1990-01-01), Whitehouse
patent: 5134508 (1992-07-01), Corda
patent: 5211565 (1993-05-01), Krajewski et al.
patent: 5280551 (1994-01-01), Bowen
patent: 5289694 (1994-03-01), Nordin
patent: 5335146 (1994-08-01), Stucke
patent: 5641294 (1997-06-01), Beard
patent: 5896473 (1999-04-01), Kaspari
patent: 6122176 (2000-09-01), Clements
patent: 6163464 (2000-12-01), Ishibashi
patent: 6247078 (2001-06-01), Ebert et al.
patent: 6422876 (2002-07-01), Fitzgerald et al.
patent: 6452789 (2002-09-01), Pallotti et al.
patent: 6538899 (2003-03-01), Krishnamurthi
patent: 6540522 (2003-04-01), Sipe
patent: 6608762 (2003-08-01), Patriche
patent: 6639795 (2003-10-01), Cooper
patent: 6814582 (2004-11-01), Vadasz et al.
patent: 6922342 (2005-07-01), Doblar et al.
patent: 2001/0046794 (2001-11-01), Edholm
patent: 2002/0181215 (2002-12-01), Guenthner
patent: 2003/0100198 (2003-05-01), Hicks et al.
Michael Fowler, “Virtual Midplane Realizes Ultrafast Card Interconnects”, Electronic Design, Dec. 9, 2002, 3 pages.
Belady Christian L.
Peterson Eric
Gandhi Jayprakash N
Haughton Anthony M
Hewlett--Packard Development Company, L.P.
LandOfFree
Cell board interconnection architecture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cell board interconnection architecture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cell board interconnection architecture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2620438