Cavity down mounting seam-welding ceramic package for semiconduc

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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29843, 257704, H01L 2302

Patent

active

055279929

ABSTRACT:
A metal cap involved in a cavity down mounting package to be subjected to a seam welding with at least a roller electrode, wherein the metal cap has a square like external shape with four corners being so rounded that each corner has a radius of curvature in the range from 1/10 to 3/8 of a length on each side of the square like shaped metal cap thereby the seam welding is carried out by a combination of a straight movement of the roller electrode along straight sides of the metal cap and adjacent part of the rounded corners to the straight sides and a rotary movement of the roller electrode around a center axis of the metal cap and the roller electrode moves along the rounded corners except adjacent portions to the straight side of the metal cap.

REFERENCES:
patent: 4015071 (1977-03-01), Peet
patent: 4331258 (1982-05-01), Geschwind
patent: 4551745 (1985-11-01), Watanabe
patent: 5117068 (1992-05-01), Seieroe et al.
patent: 5268533 (1993-12-01), Kovacs et al.
R. Ilgenfritz et al., "Parallel-Seam Weld-Sealing of Large Multilayer Ceramic Packages", 22nd Electronic Components Conference, May 1972, pp. 416-425.

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