Cathodic system with target, for vacuum sputtering apparatus for

Details Cathodic system with target, for vacuum sputtering apparatus for Cathodic system with target, for vacuum sputtering apparatus for

1978-08-02

1981-01-27

Williams, Howard S.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1500

Patent

active

042473837

ABSTRACT:
A cathodic system has a planar target for use in an atomizing apparatus for the sputtering of a dielectric or nonmagnetic coating onto a substrate. The cathodic system includes a magnetic field generator disposed on the side of the target opposite from that of the substrate and is constructed in the form of a planar coil which is disposed parallel to the target and has an area which corresponds substantially to the area of the target. The planar coil is insulated from the target and is cooled during use.

REFERENCES:
patent: 3540993 (1970-11-01), Wurm
patent: 3878085 (1975-04-01), Corbani
patent: 3887451 (1975-06-01), Cuomo
patent: 4022947 (1977-05-01), Grubb
patent: 4116791 (1978-09-01), Zega
patent: 4116806 (1978-09-01), Love
patent: 4162954 (1979-07-01), Morrison, Jr.
Current Industrial Applications of High Rate Sputtering, Hugh R. Smith, Jr., Metal Finishing, Mar. 1978, pp. 60-63.
Sputtering Cathode for Magnetic Film Deposition, B. I. Bertelsen, IBM Technical Disclosure Bulletin, vol. 6, No. 2, Jul., 1963.

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