Cathode target material compositions for magnetic sputtering

Details Cathode target material compositions for magnetic sputtering Cathode target material compositions for magnetic sputtering

1978-03-09

1979-07-03

Rutledge, L. Dewayne

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

204192C, 204192M, 427 18, C23C 1500

Patent

active

041599098

ABSTRACT:
A method for the magnetron sputtering of ferromagnetic material. An alloy of the ferromagnetic material is formed such that the alloy retains the desired characteristics of the material but the alloy has a Curie temperature that is below the sputtering temperature. In particular, the method can be applied to nickel by alloying the nickel with copper, platinum, or tin.

REFERENCES:
patent: 3609472 (1971-09-01), Bailey
patent: 3625849 (1971-12-01), Rogalla
patent: 3961946 (1976-06-01), Makino et al.
Robbins et al., "Transistion . . . in Ni-Cu Alloys" Jour. Appl. Phys., 40 (1969) 2269.
Aronson et al., "Inline . . . Magnetron Sputtering" Vacuum 27, (1977) 151.
Hoffman, ". . . Magnetron Sputtering for Metallizing . . ." Solid State Techn., Dec. 1976, pp. 57-66.

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