Cathode sputtering system

Details Cathode sputtering system Cathode sputtering system

1989-07-10

1990-07-24

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 414222, C23C 1434

Patent

active

049433636

ABSTRACT:
A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. The arm preferably comprises two leaf springs arranged parallel to one another. During the sputtering process, a pressure plate presses the substrate receptacle member and the substrate against a mask that is part of the cathode station. As a result, a cathode vacuum space is formed that is isolated from the vacuum space of the system.

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Siegle, Gert, "Herstellung dunner Metallschichten durch Kathodenzerstaubung", mrv. Metallpraxis/Oberflachentechnik, pp. 247-254.

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