Cathode sputtering device

Details Cathode sputtering device Cathode sputtering device

1990-08-15

1991-12-10

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429812, C23C 1434

Patent

active

050715356

ABSTRACT:
Cathode sputtering apparatus with a high sputtering rate, including a cathode having a cathode base 1 and a target 6 disposed parallel thereto and being provided with a channel 5 in the cathode base which is passed through by a cooling agent 12. With respect to the target 6, 10 to be cooled, this channel 5 is bounded by a thin wall 2 configured as a membrane. The wall 2 has large contact surfaces exhibiting a good heat transfer to the target surface. The contact surface between the target 6 and the wall 2 is coated with a material, e.g. a graphite layer, which has a low sputtering rate in order to delay a sputtering through as long as possible.

REFERENCES:
patent: 4290876 (1981-09-01), Nishiyama et al.
patent: 4430190 (1984-02-01), Eilers et al.
patent: 4434042 (1984-02-01), Keith
patent: 4448652 (1984-05-01), Pachomik

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