Cathode sputtering apparatus

Details Cathode sputtering apparatus Cathode sputtering apparatus

1990-04-10

1991-06-04

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429819, C23C 1434, C23C 1435

Patent

active

050211390

ABSTRACT:
In a high-rate sputtering apparatus including an anode and a cathode, the cathode having an upper sputtering surface upon which is a material to be sputtered onto a substrate, an improved cooling system. The cooling system includes a carrier plate in supporting contact with the cathode and having a lateral surface in which is formed a channel groove. Coolant tubes having outside walls in selective contact with the inside walls of the channel groove and with the lower, contact surface of the cathode are provided, with the coolant tubes further having cross-sectional profiles corresponding to those of the channel grooves. The coolant tubes may also include a plurality of longitudinally extending beads formed in the outside walls to facilitate expansion.

REFERENCES:
patent: 3718572 (1973-02-01), Robison et al.
patent: 4855033 (1989-08-01), Hurwitt

Affiliated with

Also associated with

Rating

Cathode sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cathode sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cathode sputtering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1024658