Cathode for coating a substrate

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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20429809, 20429811, 2042982, C23C 1434

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active

054826101

ABSTRACT:
In a cathode system for coating a substrate (46), having a cathode which is connected to a direct-current and/or alternating-current source (high-frequency source) and is disposed in an evacuable coating chamber (2), and is electrically connected to a target (29) which is sputtered and whose sputtered particles deposit themselves on the substrate, a process gas is brought into the coating chamber. The cathode is formed from a substantially pot-like housing (3) whose solid bottom (39) is fixedly joined to the target (29) and whose open end facing away from the target (29) is sealingly held in an opening (49) in the outer wall (30) of the coating chamber such that the interior (49) of the housing (3) is exposed to atmospheric pressure, while the target (29) and the outer surface of the shell-like part of the housing (3) joined thereto are affected by the pressure prevailing in the coating chamber.

REFERENCES:
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patent: 4340462 (1982-07-01), Koch
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Yoshiro Niimura; Masahiko Naoe: Sputter deposition of Co-Cr thin-film media on high-speed rotating disk. In: J. Vac. Sci. Technol. A5 (2) Mar./Apr. 1987, pp. 191-195.
Matsuoka, M.: et al: Preparation of ba-ferrite films for perpendicular magnetic recording by RF targets facing type of sputtering. In: IEEE Transactions on Mangetics, vol. MAG-20, No. 5, Sep. 1984, pp. 800-802.

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