Cathode assembly with localized profiling capabilities

Coating apparatus – Gas or vapor deposition – Running length work

Patent

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Details

118719, 118723, 118 501, C23C 1650

Patent

active

046089438

ABSTRACT:
An improved cathode assembly specifically designed to provide for the uniform, localized profiling of dopant or other alterant elements into the host matrix of a semiconductor alloy material which is continuously and uniformly deposited onto a moving substrate by a glow discharge deposition process.

REFERENCES:
patent: 4262631 (1981-04-01), Kubacki
patent: 4294193 (1981-10-01), Gordon
patent: 4369730 (1983-01-01), Izu et al.
patent: 4479455 (1984-10-01), Doehler et al.

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