Cathode and target design for a sputter coating apparatus

Details Cathode and target design for a sputter coating apparatus Cathode and target design for a sputter coating apparatus

1987-09-10

1989-08-08

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

048550337

ABSTRACT:
An improved cathode and sputtering target design for sputter coating, permitting operation with larger cathodes and at higher power levels than heretofore possible. The cathode and target assembly includes a cathode body, a target holder, and a sputtering target. The cathode body functions as a magnetic pole piece, a portion of the cooling system, and a mechanical stabilizer for the target. The target holder also provides cooling, by means of cooling passages and by intermeshing cooling means in contact with the target. The sputtering target has an arch-like face that promotes a controlled plastic deformation in a preselected direction, so that heat-induced expansion during operation results in the target being urged into forceful, intimate contact with at least two cooled surfaces.

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Patent Abstracts of Japan, Unexamined Applications, Jul. 11, 1985, vol. 9, No. 166, Kokai-No. 60-39 158.

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