Catalyzation processes for electroless metal deposition

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427306, 106 111, C23C 302

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active

041600509

ABSTRACT:
Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.

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