Catalytic lacquer for producing printing circuits

Details Catalytic lacquer for producing printing circuits Catalytic lacquer for producing printing circuits

1978-11-03

1981-03-03

Nielsen, Earl A.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 127, 106 128, 260 293, 260 296M, 260 296MM, C23C 302, C09D 524

Patent

active

042538750

ABSTRACT:
A catalytic lacquer for the production of printed circuit boards using basic materials and metal deposition methods. The lacquer has the following composition: a binding agent based on synthetic or natural materials; water; a metal salt; a complex former; and a reducing agent. The binding agent may be a water soluble or dispersable compound. The metal salt may be a water soluble palladium, copper, silver, gold or nickel salt, preferably the sulphate. The complex former may be in the form of a compound forming stable complexes with metal ions. The reducing agent may be in the form of formaldehyde, hydrazine or its derivatives, boron compounds, sorbitols, phosphites, or hydrophosphites. The lacquer may also include an organic solvent or solvent mixture, preferably methylene chloride. A filler and stabilizer may also be included in the composition of the lacquer. The lacquer may be applied to base materials by means of silk screen printing, and then dried so that the metal seed layer is strengthened by the action of a metal deposition reduction bath.

REFERENCES:
patent: 3361580 (1968-01-01), Schneble et al.
patent: 3372059 (1968-03-01), Roth
patent: 3454416 (1969-07-01), Heymann et al.
patent: 3607317 (1971-09-01), Schneble
patent: 3915717 (1975-10-01), Feldstein et al.
patent: 3930072 (1975-12-01), Wilks
patent: 4001470 (1977-01-01), Schulze-Berge
patent: 4002786 (1977-01-01), Hirohata et al.

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