Catalytic developer

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427304, 427305, 427306, 427430A, 427436, 427437, 427438, 106 1, B05D 304, B05D 310

Patent

active

039938018

ABSTRACT:
Improved processes and systems are described for the reception of electroless plating of non-metallic substrates, the processes comprising forming a coating of metal ions onto the non-metallic substrate, immersing the coated substrate in a developer solution containing ions selected from nickel, cobalt and copper ions and mixtures thereof and a reducing agent, and thereafter immersing the substrate in conventional electroless plating baths, e.g., nickel or cobalt-hypophosphite baths or a copper-formaldehyde bath.

REFERENCES:
patent: 3318711 (1967-05-01), Foulke
patent: 3620804 (1971-11-01), Bauer
patent: 3666527 (1972-05-01), Feldstein
patent: 3667991 (1972-06-01), Miller
patent: 3697319 (1972-10-01), Feldstein
patent: 3745039 (1973-07-01), Feldstein
patent: 3772056 (1973-11-01), Polichette
patent: 3772078 (1973-11-01), Polichette

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