Catalyst for electroless plating

Details Catalyst for electroless plating Catalyst for electroless plating

1989-01-19

1991-01-22

Garvin, Patrick P.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C23C 1808

Patent

active

049868489

ABSTRACT:
A catalyst for electroless plating comprising a divalent palladium compound, a lower alkylamine, and aminopyridine in the form of aqeuous solution having a pH of 7 to 14 can give uniform deposition and high throwing power of copper on inner walls of through-holes in printing wiring boards without causing a hollowing phenomenon.

REFERENCES:
patent: 3960573 (1976-06-01), Zeblisky
patent: 3962494 (1976-06-01), Nuzzi
patent: 3962496 (1976-06-01), Leech
patent: 3962497 (1976-06-01), Doty et al.
patent: 3978252 (1976-08-01), Lombardo et al.
patent: 4248632 (1981-02-01), Ehrich et al.
patent: 4301196 (1981-11-01), McCormack et al.
Patent Abstracts of Japan, vol. 9, No. 138 (C-286), [1861] 13, Jun. 1985, & JP-A- 60 24 380 (Hitachi Ltd.).

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