Catalyst for electroless deposition of metals

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427229, 427226, 427261, 427282, 427306, 427307, 156 3, B05D 512

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active

039378578

ABSTRACT:
A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of palladium is trimethyl phosphite palladium dichloride; a requirement for a proper thermal exposure of the complex is that the substrate is capable of withstanding the elevated temperatures such as above 210.degree.C; illustrative organic substrates are polyimides, polysulfones, silicones, vulcanizates, fluoroplastics, polyphenylene sulfides, polyparabanic acids, and polyhydantoin, etc.

REFERENCES:
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patent: 3509624 (1970-05-01), Boucher
patent: 3684534 (1972-08-01), Emerson
patent: 3697319 (1972-10-01), Feldstein
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patent: 3767538 (1973-10-01), Politycki et al.
patent: 3767583 (1973-10-01), Fadgen, Jr. et al.
patent: 3791848 (1974-02-01), DeAngelo

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