Catalyst composition for forming electroless plating on ceramics

Details Catalyst composition for forming electroless plating on ceramics Catalyst composition for forming electroless plating on ceramics

1985-11-15

1986-11-11

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106193R, 427229, 427305, 524204, 524398, 524399, C23C 302

Patent

active

046220690

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

This invention relates to catalyst compositions for forming electroless plating on ceramics and more particularly to a composition for depositing a catalyst metal of a ceramic substrate prior to formation of a metallic layer of copper or nickel on said substrate.


BACKGROUND ART

The technology of forming a metallic conductive layer on a ceramic surface has been employed widely in the manufacture of electronic parts and other articles. One of such methods is the method known as electroless plating. As ceramics are not receptive to electroless plating baths, it is necessary that the surface of a ceramic substrate be previously treated with a catalyst metal such as palladium, silver or the like prior to the formation of a metallic layer by electroless plating. The methods heretofore known for applying a catalyst metal to the substrate surface include (a) the process which comprises dipping a ceramic substrate in a solution of the catalyst metal in acidic aqueous medium, (b) a process in which the ceramic substrate is treated with a bath prepared by dissolving or dispersing a catalyst metal compound in an organic medium by a suitable technique such as dipping, brushing or spraying and the substrate so treated is then heated, and (c) a process in which a composition prepared by dissolving or dispersing the catalyst metal compound in an organic or other vehicle is printed on the substrate and the printed substrate is then heated. However, these known methods for catalyst metal pretreatment have at least one of the following disadvantages that must be overcome.
(a) The process is costly because the expensive catalyst metal compound must be provided in high concentration.
(b) The composition containing the catalyst metal compound has a poor storage stability.
(c) The deposition and adhesive characteristics of the electroless plating metal applied after application of the catalyst metal with respect to the ceramic substrate are not fully satisfactory.
(d) There is a serious limitation to the type of ceramic materials that can be treated.
(e) When the catalyst metal is applied to the ceramic substrate by screen printing, partial dipping or the like, the dimensional accuracy of the metal plating layer is sacrificed.


DISCLOSURE OF THE INVENTION

We conducted a series of experiments and studies in regard to the method for applying a catalyst metal to a ceramic substrate prior to electroless plating and found that the use of a composition comprising a specific palladium and/or silver compound and a specific organic metal compound results in a substantial elimination or a marked alleviation of the problems inevitable with the conventional methods. Thus, this invention provides the following composition (hereinafter referred to as Invention I).
(1) A catalyst composition for forming electroless plating on ceramics which comprises: H.sub.5)].sub.2, of organic metal compounds of the general formulas: H.sub.5)].sub.2, 18, and n" is an integer of 2 to 4; M is copper, nickel, iron, aluminum, zinc or tin] and
Our studies further revealed that incorporation of a high molecular compound and/or a particulate inorganic substance in the composition of invention I results in a further improvement in adhesion or adhesive affinity between the ceramic substrate and metal plating layer. Thus, this invention provides also the following composition (hereinafter referred to as Invention II).
(2) A catalyst composition for forming electroless plating on ceramics which comprises: of H.sub.5)].sub.2, consisting of organic metal compounds of the general formulas: H.sub.5)].sub.2, 18, n" is an integer of 2 to 4, and M denotes copper, nickel, iron, aluminum, zinc or tin], of high molecular compounds and particulate inorganic substances.
The respective components of the composition according to this invention will hereinafter be described in detail.
(1) The organic palladium and organic silver compounds employed in this invention are the compounds each obtainable by a coordination reaction between an aliphatic or aromatic seco

REFERENCES:
patent: 4150995 (1979-04-01), Moritsu et al.
patent: 4248632 (1981-02-01), Ehrich et al.
patent: 4262040 (1981-04-01), Russo
patent: 4418099 (1983-11-01), Cuevas et al.

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