Casting of raised bump contacts on a substrate

Details Casting of raised bump contacts on a substrate Casting of raised bump contacts on a substrate

1993-09-15

1995-01-17

Ramsey, Kenneth J.

Metal founding

Process

Shaping liquid metal against a forming surface

22818022, 228254, B23K 300

Patent

active

053818482

ABSTRACT:
A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A mold is provided for receiving a substrate. Recesses in the mold are shaped to form contacts of a desired size, and are arranged to align with contact pads on the surface of the substrate. When the substrate is inserted into the mold and the mold is closed, the contact pads align with the recesses. Molten solder is introduced into the recesses and, upon cooling, forms conductive raised bump contacts on the contact pads. The substrate is then removed from the mold. Various features of the invention are directed to forming "tall" contacts with an aspect ratio (height to width ratio) of greater than 1:1, processing more than one substrate at a time, processing substrates of different sizes, and processing substrates with different contact patterns.

REFERENCES:
patent: 3628598 (1971-12-01), MacNeill et al.
patent: 3912544 (1975-10-01), Sabatino
patent: 5244143 (1993-09-01), Ference et al.

Affiliated with

Also associated with

Rating

Casting of raised bump contacts on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Casting of raised bump contacts on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Casting of raised bump contacts on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-742215