Metal fusion bonding – Process – With shaping
Patent
1982-03-15
1983-11-01
Godici, Nicholas P.
Metal fusion bonding
Process
With shaping
228180A, 29843, 29874, 29884, B23K 3102
Patent
active
044126425
ABSTRACT:
The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board, and to board flexure. Herein disclosed is a lead (15) for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g., solder material. Also disclosed is a method for casting such a solder lead, and a method for attaching a plurality of cast solder leads (38) to a leadless chip carrier (20).
REFERENCES:
patent: 3171175 (1965-03-01), Curcio
patent: 3429040 (1969-02-01), Miller
patent: 3589000 (1971-06-01), Galli
patent: 3604836 (1971-09-01), Pierpont
patent: 3719981 (1973-03-01), Steitz
patent: 3835531 (1974-09-01), Luttmer
patent: 3854521 (1974-12-01), Hannes
patent: 3864827 (1975-02-01), Schreiner et al.
patent: 4179802 (1979-12-01), Joshi et al.
"Leadless Carriers", by P. R. Jones, in Electronics, Aug. 25, 1981, pp. 137-140.
A Guide to Preform Soldering, Alloys Unlimited, Inc. 1959.
de Picciotto M. M.
Godici Nicholas P.
Jordan M.
Western Electric Co. Inc.
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