Cassette buffering within a minienvironment

Details Cassette buffering within a minienvironment Cassette buffering within a minienvironment

1999-05-18

2003-09-02

Keenan, James W. (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S217100, C414S411000, C414S940000

Reexamination Certificate

active

06612797

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the transfer of workpieces such as semiconductor wafers from a storage and transport pod to a process tool, and in particular to a system for allowing pods to be buffered within a minienvironment adjacent a process tool.
2. Description of Related Art
A SMIF system proposed by the Hewlett-Packard Company is disclosed in U.S. Pat. Nos. 4,532,970 and 4,534,389. The purpose of a SMIF system is to reduce particle fluxes onto semiconductor wafers during storage and transport of the wafers through the semiconductor fabrication process. This purpose is accomplished, in part, by mechanically ensuring that during storage and transport, the gaseous media (such as air or nitrogen) surrounding the wafers is essentially stationary relative to the wafers, and by ensuring that particles from the ambient environment do not enter the immediate wafer environment.
A SMIF system has three main components: (1) minimum volume, sealed pods used for storing and transporting wafers and/or wafer cassettes; (2) an input/output (I/O) minienvironment located on a semiconductor processing tool to provide a miniature clean space (upon being filled with clean air) in which exposed wafers and/or wafer cassettes may be transferred to and from the interior of the processing tool; and (3) an interface for transferring the wafers and/or wafer cassettes between the SMIF pods and the SMIF minienvironment without exposure of the wafers or cassettes to particulates. Further details of one proposed SMIF system are described in the paper entitled “SMIF: A TECHNOLOGY FOR WAFER CASSETTE TRANSFER IN VLSI MANUFACTURING,” by Mihir Parikh and Ulrich Kaempf,
Solid State Technology
, July 1984, pp. 111-115.
Systems of the above type are concerned with particle sizes which range from below 0.02 microns (&mgr;m) to above 200 &mgr;m. Particles with these sizes can be very damaging in semiconductor processing because of the small geometries employed in fabricating semiconductor devices. Typical advanced semiconductor processes today employ geometries which are one-half &mgr;m and under. Unwanted contamination particles which have geometries measuring greater than 0.1 &mgr;m substantially interfere with 0.5 &mgr;m geometry semiconductor devices. The trend, of course, is to have smaller and smaller semiconductor processing geometries which today in research and development labs approach 0.1 &mgr;m and below. In the future, geometries will become smaller and smaller and hence smaller and smaller contamination particles and molecular contaminants become of interest.
SMIF pods are in general comprised of a pod door which mates with a pod shell to provide a sealed environment in which wafers may be stored and transferred. So called “bottom opening” pods are known, where the pod door is horizontally provided at the bottom of the pod, and the wafers are supported in a cassette which is in turn supported on the pod door. It is also known to provide “front opening” pods, in which the pod door is located in a vertical plane, and the wafers are supported either in a cassette mounted within the pod shell, or to shelves mounted in the pod shell. For both front opening and bottom opening pods, a pod door includes an interior surface which is included as part of the sealed pod environment, and an exterior surface which is exposed to the environment of the wafer fab.
In conventional SMIF systems, in order to transfer workpieces such as semiconductor wafers between a SMIF pod and a process tool within a wafer fab, a pod is typically loaded either manually or automatedly onto a load port of a minienvironment on the front of the tool. Thereafter, mechanisms within the load port decouple the pod shell from the pod door, and then mechanisms within the SMIF interface separate the shell from the door to allow transfer of the cassette and/or wafers. A workpiece handling robot thereafter transfers the workpiece(s) to and from the process tool for processing. After processing of the workpiece(s) at the tool is finished, and the workpiece(s) have been returned to the pod, the SMIF interface thereafter couples the shell and door together, and the pod is transferred from the load port so that the next pod may be brought to the tool and the process repeated.
Presently, a semiconductor wafer fab may cost in excess of $1 billion to outfit, and approximately 80% of that cost is the cost of process tools. It is therefore desirable to maximize the utilization of these tools, and substantial efforts are devoted to minimizing the time that the tools sit idle. In order to prevent significant idle time, it is known to include a local tool buffer adjacent the tool load ports at one or more of the process tools. A local tool buffer allows pods to be stored locally adjacent the tools and quickly transferred to the tool load port without having to constantly retrieve a pod from a remotely located stocker, or depend on timely delivery therefrom. A conventional local tool buffer is shown generally at
10
adjacent a process tool
12
in FIG.
1
. As shown therein, a pod handling robot
14
is capable of transferring pods
16
between a plurality of local shelves
18
and the tool load ports
20
on the process tool
12
.
Conventional local buffers, such as that shown in
FIG. 1
, have several shortcomings. First, they take up a significant amount of space within a wafer fab, which space is at a premium. Second, even though local tool buffers are able to supply pods to a load port in a timely manner, valuable time is still spent separating the cassette from within the pod upon initial loading of the pod on the load port, as well as when returning the cassette to the pod after processing of the workpieces in that cassette has been completed. The processing tool may be sitting idle during this time. It is known to provide two load ports on a process tool, so that a cassette may be separated from or returned to a pod on the first port while processing on workpieces from a pod on the second port is taking place. However, it is not feasible to provide a second load port on certain process tool configurations. Additionally, processing tools which are able to support two load ports require duplicate componentry for each load port, thus raising the cost and complexity of operation. Further still, two load ports take up additional space on the front end of the process tool, which space is at a premium.
SUMMARY OF THE INVENTION
It is therefore an advantage of the present invention to provide a cassette buffer for storing two or more cassettes within a minienvironment of the SMIF interface affixed to the process tool.
It is a further advantage of the present invention to allow loading of a new workpiece cassette into a process tool as soon as processing on the previous workpiece cassette has been completed.
It is a still further advantage of the present invention to decouple the process of cassette loading into the process tool from the delivery sequence of pods to the process tool.
It is another advantage of the present invention to utilize mechanisms that are presently in use for cassette loading in performing the additional function of improving tool throughput.
It is a further advantage of the present invention to operate with so-called “SMART tag” technology so that workpiece lots may be brought to a load port in one pod and transferred away in a second pod, without losing any identification information relating to that particular workpiece lot.
These and other advantages are provided by the present invention which in preferred embodiments relates to a system for buffering two or more cassettes within a minienvironment affixed to a process tool. The present invention is provided as part of a SMIF interface mounted on a frame affixed to the front end of a process tool. The interface includes a load port formed of a port door and a port plate circumjacent thereabout, and a minienvironment mounted to the port plate. The load port is provided for receiving a cassette-carrying pod and decoupling the p

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