Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-12-16
2000-12-26
Gandhi, Jayprakash N.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361753, 439148, 174 35R, H05K 900
Patent
active
061669199
ABSTRACT:
A filler module is slidably mountable in an otherwise unused slot of a multi-slot, multi-module electronic system housed in a casing. The filler module includes a relatively compact housing which engages an EMI gasket and an electric connector in an unused slot at the backplane of a shelf in the casing. The module also includes a non-conductive, rigid extension element which facilitates air flow between adjacent modules within the rack. The extension element may include electrically conductive strips which provide ESD protection during the insertion of the module through intimate contact with a grounded, resilient contacting surface. The module may also comprise a non-conductive bulkhead with pivoted latches which engage the casing to secure the housing to the backplane. In this way, a filler module is achieved in which EMI containment is accomplished in a modular fashion and air flow is maintained in the shelf independent of the number or position of used and unused slots. Modular EMI containment is particularly well suited for use in high speed (e.g., 2.5 to 10 GHz) electronic systems such as synchronous optical network transport nodes.
REFERENCES:
patent: 4542443 (1985-09-01), Rinefierd, Jr.
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4829432 (1989-05-01), Hershberger et al.
patent: 4872212 (1989-10-01), Roos et al.
patent: 4953058 (1990-08-01), Harris
patent: 4960391 (1990-10-01), Beinhaur et al.
patent: 4970625 (1990-11-01), Belanger et al.
patent: 5023754 (1991-06-01), Aug et al.
patent: 5125854 (1992-06-01), Bassler et al.
patent: 5309315 (1994-05-01), Naedel et al.
patent: 5359492 (1994-10-01), Porter
patent: 5388995 (1995-02-01), Rudy, Jr. et al.
patent: 5430618 (1995-07-01), Huang
patent: 5539620 (1996-07-01), Gale et al.
patent: 5725387 (1998-03-01), O'Sullivan et al.
Barber Robert J.
Nicolici Radu-Marko
Weber John F.
Gandhi Jayprakash N.
Notrel Networks Corporation
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