Casing having a layer for protecting a semiconductor memory to b

Details Casing having a layer for protecting a semiconductor memory to b Casing having a layer for protecting a semiconductor memory to b

1979-12-19

1982-04-06

Smith, John D.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29588, 156 89, 250515, 357 80, 427 5, 427 9, 427 34, 427 96, H01L 2306

Patent

active

043234054

ABSTRACT:
A hermetic cap member of a casing for a semiconductor memory element is provided with a protection layer on a recessed surface facing the memory element. The protection layer is of at least one material which does not emit alpha particles and has a thickness sufficient to prevent alpha particles from being emitted from the cap member onto the memory element. Specifically, the protection layer may be a plate of a pertinent one of the following silicon of high purity, 42 alloy, or Kovar and is attached to the cap member by the use of an adhesive of glass frit. Alternatively, the protection layer may be made from a metallic paste of silver, silver-palladium, or gold-palladium by firing the same onto the cap member. The protection layer may also be magnesium oxide formed by the use of a plasma spray process. As a further alternative, the protection layer may consist of a plurality of materials.

REFERENCES:
patent: 3706010 (1972-12-01), Laermer et al.
patent: 3769560 (1973-10-01), Miyake et al.
patent: 4032350 (1977-06-01), Greenstein
patent: 4081825 (1978-03-01), Koopman et al.
patent: 4099200 (1978-07-01), Koutalides
patent: 4142203 (1979-02-01), Dietz

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