Casing for integrated circuit chips and method of fabrication

Details Casing for integrated circuit chips and method of fabrication Casing for integrated circuit chips and method of fabrication

1997-06-13

2000-04-18

Arbee, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 522, 438122, H01R 4300

Patent

active

060499710

ABSTRACT:
A method for fabricating a lead frame that includes a platform attached thereto for mounting a chip. A base frame is provided for mounting chips of various sizes. The base frame includes connection leads extending toward a central portion, which is substantially of the size of the smallest chip to mount. Connection leads are cut-out about the central portion to form an opening corresponding to the size of the chip to be mounted. A platform is soldered to at least two support leads to form the lead frame.

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