Casing for electronic components

Details Casing for electronic components Casing for electronic components

1984-05-31

1985-06-04

Lesmes, George F.

Stock material or miscellaneous articles

Hollow or container type article

Cellular material derived from plant or animal source

428413, 428418, 428 76, 264300, 427 96, 148 616, 148 615R, B65D 6528

Patent

active

045214697

ABSTRACT:
A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.

REFERENCES:
patent: 3541041 (1970-11-01), Hermann et al.
patent: 3677828 (1972-07-01), Caule
patent: 3716427 (1973-02-01), Caule
patent: 3728177 (1973-04-01), Caule
patent: 3728178 (1973-04-01), Caule
patent: 3764399 (1973-10-01), Caule
patent: 3833433 (1974-09-01), Caule
patent: 3837929 (1974-09-01), Caule
patent: 3853691 (1974-12-01), Caule
patent: 3940303 (1976-02-01), Caule
patent: 3941627 (1976-03-01), Caule
patent: 3941628 (1976-03-01), Caule
patent: 3944449 (1976-03-01), Caule
patent: 3988284 (1976-10-01), Wurmb et al.
patent: 4136149 (1979-01-01), Payne
patent: 4143024 (1979-03-01), Adelmann et al.
patent: 4264379 (1981-04-01), Caule
patent: 4356233 (1982-10-01), Lange et al.
patent: 4358552 (1982-11-01), Shimohara et al.
Neighbour et al., "Factors Governing Aluminum Interconnection Corrosion in Plastic Encapsulated Microelectronic Devices", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 16, 1977, pp. 161-164.

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