Casette and two-layer type of wire-connection chassis

Details Casette and two-layer type of wire-connection chassis Casette and two-layer type of wire-connection chassis

1999-09-17

2001-04-03

Sircus, Brian (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

C439S079000, C439S080000

Reexamination Certificate

active

06210236

ABSTRACT:

BACKGROUND OF THE INVENTION
The two-layer type of wire-connection chassis as shown in
FIG. 8
is a novel wire-connection chassis of the applicant's filed previously (under application No. 82313632 and new model application No. 103909); the prime feature of the aforesaid application is to improve the drawback of the conventional one-layer type of wire-connection chassis, which takes a considerable area and space of a PCB (printed circuit board), while the present invention will reduce the area and space required by the electronic parts without affecting the functions thereof. The structure of the previous invention as shown in
FIG. 8
comprises a receptacle body
24
, an upper-layer conductive pin base, a lower-layer conductive pin base, and a plurality of conductive pins respectively. As shown in
FIG. 5
, the wire-connection chassis can be plugged on a PCB
26
by means of a plurality of conductive pins
25
; then, both of them are mounted in casings
29
and
30
; the bottom surface of the PCB
26
is almost attached to the casing
30
, and the space supported with some short post
28
them is too marrow to install any electronic parts; in other words, electrical parts
27
can only be mounted on the top surface of the PCB. In that case, the space available is limited, while the space in the casings
29
and
30
is wasted; as a result, the dimensions of the equipment will be increased without providing additional functions of the equipment, and therefore improvement thereof is required.
SUMMARY OF THE INVENTION
In view of the drawbacks of the aforesaid conventional two-layer type of wire-connection chassis and the PCB thereof, some improvements are required; therefore, the inventor has developed further improvements for the previous two-layer type of wire-connection chassis. The improved chassis not only can provide it with a simple structure, but also can provide a structure, in which the upper-layer and the lower-layer pins extend out of the mid-section of the seal plate of the wire-connection chassis so as to facilitate a PCB to assemble with the chassis; then, both sides of the PCB mounted in the middle of the casing can be mounted or soldered with electrical parts; in other words, the limited space in the casing will be used completely and fully, and it is deemed quite useful to the current equipment which all require a popularity of small and thin dimensions.


REFERENCES:
patent: 4820173 (1989-04-01), Thom et al.
patent: 4932885 (1990-06-01), Scholz
patent: 4968266 (1990-11-01), Yamamoto
patent: 4997376 (1991-03-01), Buck et al.
patent: 5531612 (1996-07-01), Goodall et al.
patent: 5562507 (1996-10-01), Kan
patent: 5823799 (1998-10-01), Tor et al.

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