Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-08-11
2000-04-25
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
H05K 720
Patent
active
060551569
ABSTRACT:
A computer case shaped to provide cooling of the computer's electronic parts is described. The case is formed from metal or thin plastic which can be stamped or injection molded in the desired shape for cooling. The case has a plurality of sides and a bottom. In a first aspect, a plurality of ribs is formed on at least one of the sides, thereby increasing the surface area available for heat dissipation. The bottom may also be corrugated. In a second aspect, slots are provided in at least one of the sides, and the heat generating microprocessor is positioned adjacent to the slotted sides. In a third aspect, a plate is attached to the bottom by means of angled edges at the periphery of the plate so as to allow a gap between the attached plate and the case bottom for trapping a gas therebetween and providing insulation from heat at the case bottom. Optionally, openings are provided in the angled edges for additional convective cooling of the case bottom.
REFERENCES:
patent: 3364395 (1968-01-01), Donofrio et al.
patent: 5065278 (1991-11-01), Schultz
patent: 5309315 (1994-05-01), Naedel et al.
patent: 5440450 (1995-08-01), Lau et al.
patent: 5634351 (1997-06-01), Larson et al.
patent: 5666261 (1997-09-01), Aguilera
patent: 5751550 (1998-05-01), Korinsky
International Business Machines - Corporation
Percello Louis J.
Thompson Gregory
LandOfFree
Case for portable computers for enhanced heat dissipation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Case for portable computers for enhanced heat dissipation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Case for portable computers for enhanced heat dissipation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-998721