Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-11-06
1991-07-09
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361393, 439 75, H01R 909
Patent
active
050301101
ABSTRACT:
A cage assembly for stacking one or more PRIOR ART integrated circuit packages or leadless chip carriers (LCC), and for electrically and mechanically interconnecting the LCCs selectively to each other and to a PRIOR ART printed circuit board (PCB). The cage assembly includes a flexible wafer with an electrical conductor pattern that is electrically and mechanically connected to an LCC positioned thereon, is mechanically retained by a rigid cage member. The cage member electrically interconnects the one or more LCCs positioned in a stacked relationship, and can be electrically and mechanically connected to a PCB.
REFERENCES:
patent: 3205298 (1965-09-01), Kalt
patent: 3262023 (1966-07-01), Boyle
patent: 3696323 (1972-10-01), Kinkaid et al.
patent: 4169642 (1979-10-01), Mouissie
patent: 4231154 (1980-11-01), Gazdik et al.
patent: 4520427 (1985-05-01), Brotherton
patent: 4595794 (1986-06-01), Wasserman
patent: 4696525 (1987-09-01), Coller et al.
patent: 4871317 (1989-10-01), Jones
IBM Bulletin, Roche et al., vol. 6, No. 8, p. 87, 1-1964.
Groves Henry T.
Hultberg Frank R.
Klacks John A.
Abrams Neil
Litton Systems Inc.
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