Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-08-16
2005-08-16
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S716000, C257S719000
Reexamination Certificate
active
06930385
ABSTRACT:
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
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Adams Donald J.
Ayers Curtis W.
Coomer Chester
Hsu John S.
Marlino Laura D.
Lee Eddie
Owens Doulgas W.
UT-Battelle LLC
Wilson Kirk A.
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