Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1999-06-21
2000-12-26
Mis, David
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257723, 257786, H01L 23485, H01L 2352, H01L 23522, H01L 2940
Patent
active
061664448
ABSTRACT:
A cascade-type chip module. A laminate substrate having contacts is provided. Chips suitable for the cascade-type module are provided. Each chip includes a redistribution layer having a first region and a second region and bump contacts over the redistribution layer. A layout of the bump contacts coupling with the first region of the redistribution layer is an image rotationally symmetrical to the layout of those coupling with the second region of the redistribution layer, and each of the bump contacts coupling with the first region is coupled with a corresponding bump contact coupling with the second region through the redistribution layer. The chips are divided into a first group and a second group; the first group is stacked on the second group such that the first region of each chip of the first group is aligned with the second region of each chip of the second group and the second region of each chip of the first group is aligned with the first region of each chip of the second group. The chips are coupled to each other by bumps. The chips are attached to the laminate substrate and the first group and the second group are respectively coupled with the contacts by two film carriers.
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patent: 5614766 (1997-03-01), Takasu et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 5872700 (1999-02-01), Collander
patent: 6057598 (2000-05-01), Payne et al.
patent: 6091138 (2000-07-01), Yu et al.
Han Charlie
Hsuan Min-Chih
Mis David
United Microelectronics Corp.
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