Carrier tape including molten resin flow path element for resin

Details Carrier tape including molten resin flow path element for resin Carrier tape including molten resin flow path element for resin

1988-12-08

1991-11-12

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428901, 428906, 428134, 428137, 174 524, 357 70, 437206, 437207, 437217, 437220, B32B 310, H01L 2156

Patent

active

050647067

ABSTRACT:
A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.

REFERENCES:
patent: 4049903 (1977-09-01), Kobler
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4763409 (1988-08-01), Takekawa et al.

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