Carrier tape for bonding IC devices and method of using the same

Details Carrier tape for bonding IC devices and method of using the same Carrier tape for bonding IC devices and method of using the same

1989-03-31

1990-12-25

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428131, 428156, 428901, 428906, 174 524, 361398, 29827, 437206, 437220, 357 70, 357 80, 206330, B32B 310, H01L 2184, H01L 2348, B65D 7302

Patent

active

049802194

ABSTRACT:
A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved. Positioning holes are formed in the carrier tape at intervals corresponding to a plurality of columns of IC device holes, and each processing can be performed for a carrier tape portion between the positioning holes in units of a plurality of columns. The carrier tape can be manufactured with very high efficiency.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3968563 (1976-07-01), Hamlin
patent: 4049903 (1977-09-01), Kobler
patent: 4551912 (1985-11-01), Marks et al.
patent: 4558551 (1985-12-01), Goulstone et al.
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4801997 (1989-01-01), Ono et al.

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