Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating lead frame or beam lead
Patent
1997-10-08
1999-12-28
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating lead frame or beam lead
216 39, 216 47, 216 31, 257666, 29827, 438754, 361813, H01L 2100, B44C 122
Patent
active
060077298
ABSTRACT:
The purpose of this invention is to provide a type of carrier tape with inner leads arranged at small pitches.
When first wirings 11, second wirings 12, and pitch-converting wirings 14 are formed by etching resin film 8, second wirings 12 and pitch-converting wirings 14 become thinner than first wirings 11. First wirings 11 are formed on film tape 3, and second wirings 12 are formed in hole 15 formed on the aforementioned film tape. Also, pitch-converting wirings 14 are formed on resin film 9 formed in said hole 15. In this way, second wirings 12 arranged at small pitches and first wirings 11 arranged at large pitches can be connected to each other by pitch-converting wirings 14 without creating any short circuit. First wirings 11 can be used for connection to a liquid crystal panel, and second wirings 12 can be used for connection to semiconductor elements.
REFERENCES:
patent: 3795044 (1974-03-01), Peltz
patent: 4711700 (1987-12-01), Cusack
patent: 4733292 (1988-03-01), Jarvis
patent: 4786545 (1988-11-01), Sakuma et al.
Donaldson Richard L.
Kempler William B.
Powell William
Texas Instruments Incorporated
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