1989-12-04
1993-03-23
Pascal, Robert J.
357 80, H01L 2348
Patent
active
051969173
ABSTRACT:
A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip. The resultant chip is placed within a cavity of a mold, and a molten resin is injected into the cavity through the opening or recess passage formed in the link portion of the film.
REFERENCES:
patent: 4803542 (1989-02-01), Tohrani
patent: 4915607 (1990-04-01), Medders et al.
patent: 4967260 (1990-11-01), Butt
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5064706 (1991-11-01), Ueda et al.
Michii Kazunari
Nakagawa Osamu
Shimomura Kou
Takemura Seiji
Ueda Tetsuya
Mitsubishi Denki & Kabushiki Kaisha
Pascal Robert J.
Ratliff R. A.
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