Carrier substrate and integrated circuit

Details Carrier substrate and integrated circuit Carrier substrate and integrated circuit

2011-04-05

2011-04-05

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S738000, C257SE23010, C257SE21476

Reexamination Certificate

active

07919868

ABSTRACT:
A carrier substrate comprising a through contact connecting a first contact field on a top face of the carrier substrate to a second contact field on a bottom face of the carrier substrate and a substrate material being provided around the through contact.

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Lingbo Zhu, et al., “Aligned Carbon Nanotubes for Electrical Interconnect and Thermal Management”; Proceedings of the IEEE 2005 Electronic Components and Technology Conference, vol. 1, pp. 44-50, May 31-Jun. 3, 2005.

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