Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-10-19
2010-11-09
Menz, Laura M (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S679000, C257S700000
Reexamination Certificate
active
07829987
ABSTRACT:
Carrier structure embedded with semiconductor chips and method for manufacturing the same are disclosed. The carrier structure comprises a metal plate and pluralities of semiconductor chips. An adhesive material is disposed on both surfaces of the metal plate, and pluralities of cavities are formed through the metal plate. The semiconductor chips are embedded in the cavities and mounted in the metal plate. The semiconductor chips each have an active surface on which pluralities of electrode pads are disposed. A built-up structure is formed on the surface of the carrier structure and the active surfaces of the semiconductor chips, which has pluralities of conductive vias therein to conduct the semiconductor chips, and has pads thereon. Besides, the metal plate has an etching cavity between the semiconductor chips, and the etching cavity is filled with the adhesive material. The present invention solves the problem of metal burrs being formed when cutting.
REFERENCES:
patent: 6709898 (2004-03-01), Ma et al.
patent: 6964881 (2005-11-01), Chua et al.
patent: 7087992 (2006-08-01), Chua et al.
patent: 7109063 (2006-09-01), Jiang
patent: 7135780 (2006-11-01), Jiang
patent: 7242092 (2007-07-01), Hsu
patent: 7273770 (2007-09-01), Edelstein et al.
patent: 7312101 (2007-12-01), Jiang et al.
patent: 7321455 (2008-01-01), Kinsman
patent: 7329949 (2008-02-01), Jiang et al.
patent: 7358615 (2008-04-01), Heck et al.
patent: 7362580 (2008-04-01), Hua et al.
patent: 7364934 (2008-04-01), Street et al.
patent: 7417299 (2008-08-01), Hu
patent: 7446402 (2008-11-01), Hsu
patent: 7452797 (2008-11-01), Kukimoto et al.
patent: 7498606 (2009-03-01), Street et al.
patent: 7550847 (2009-06-01), Jiang et al.
patent: 7582961 (2009-09-01), Chia et al.
patent: 7608923 (2009-10-01), Hsu
patent: 7635611 (2009-12-01), Jiang
patent: 7655500 (2010-02-01), Jiang et al.
patent: 7659143 (2010-02-01), Tang et al.
patent: 2004/0155325 (2004-08-01), Ma et al.
patent: 2006/0043549 (2006-03-01), Hsu
patent: 2006/0087037 (2006-04-01), Hsu
patent: 2006/0145328 (2006-07-01), Hsu
patent: 2006/0175692 (2006-08-01), Hsu
patent: 2006/0186531 (2006-08-01), Hsu
patent: 2006/0186536 (2006-08-01), Hsu
patent: 2007/0111398 (2007-05-01), Hsu
patent: 2008/0029895 (2008-02-01), Hu et al.
patent: 2008/0128865 (2008-06-01), Chia
patent: 2008/0179725 (2008-07-01), Chia et al.
patent: 2009/0045513 (2009-02-01), Kim et al.
patent: 2010/0006331 (2010-01-01), Hsu
Bacon & Thomas PLLC
Menz Laura M
Unimicron Technology Corp.
LandOfFree
Carrier structure embedded with semiconductor chips and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carrier structure embedded with semiconductor chips and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier structure embedded with semiconductor chips and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4212989