Carrier structure

Motor vehicles – Power – Radiators and condensers – mounting

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C180S068600

Reexamination Certificate

active

11039829

ABSTRACT:
A carrier structure has an inside member formed of a plastic material, an outer member formed of steel coupled to the inside member, and a bracket formed at a lower end of the outer member for reducing the weight of the carrier. The bracket is coupled to the inner member at a portion for mounting a radiator by an over-molding method, thereby enhancing the mounting strength of a cooling system.

REFERENCES:
patent: 5409288 (1995-04-01), Masuda
patent: 5575526 (1996-11-01), Wycech
patent: 5658041 (1997-08-01), Girardot et al.
patent: 5884960 (1999-03-01), Wycech
patent: 6168226 (2001-01-01), Wycech
patent: 6196624 (2001-03-01), Bierjon et al.
patent: 6273496 (2001-08-01), Guyomard et al.
patent: 6405788 (2002-06-01), Balthazard
patent: 6412855 (2002-07-01), Cantineau et al.
patent: 6502653 (2003-01-01), Balzer et al.
patent: 6679545 (2004-01-01), Balzer et al.
patent: 6681876 (2004-01-01), Haneda et al.
patent: 6708790 (2004-03-01), Ozawa et al.
patent: 6715573 (2004-04-01), Emori et al.
patent: 6729424 (2004-05-01), Joutaki et al.
patent: 6796604 (2004-09-01), Igura et al.
patent: 6955393 (2005-10-01), Staargaard et al.
patent: 7117926 (2006-10-01), Mori et al.
patent: 2005/0067896 (2005-03-01), Kim et al.
patent: 2006/0207815 (2006-09-01), Vandekerkhof
patent: 11-139344 (1999-05-01), None
patent: 10-2004-0033489 (2004-04-01), None
patent: 10-2004-0036089 (2004-04-01), None
English Language Abstract of JP 11-139344.
English Language Abstract of JP 10-2004-0036089.
English Language Abstract of JP 10-2004-0033489.
U.S. Appl. No. 10/973,342, to Lee, filed Oct. 27, 2004.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3896631

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.